内容简介：
【内容简介】 Plasma Chemistry and Plasma Processing is an international journal for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The broad coverage of experimental, analytical and numerical studies includes both non-equilibrium (`cold') and equilibrium (`hot') plasmas. Pertinent diagnostic studies are also encouraged. Typical subject areas are: etching, deposition of thin films and protective coatings, annealing, polymerization, preparation of amorphous and crystalline materials, surface modification, techniques for making electronic devices, and techniques for analytical chemistry. Other topics of interest include volume reactions in inorganic and organic systems, thermal plasma synthesis, metallurgy, fuming, coal gasification and desulfurization, spheroidization, spraying, surfacing and modeling of plasma reactors.
2001, Volume 21 (4 issues), ISSN 0272-4324
Editor: Emil Pfender Dept. of Mechanical Enginering, University of Minnesota, Minneapolis, USA
Stan Veprek Institute for Chemistry of Inorganic Materials, Technical University of Munich, Germany
Susan Safren Publishing Editor
Kluwer Academic/ Plenum Publishers Ms. S.L. Safren 233 Spring Street New York 10013-1578 U.S.A.
