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RHEOLOGICAL PROPERTIES MODIFICATION OF ENGINEERING RESINS USING ULTRA-HIGH MOLECULAR WEIGHT ADDITIVES
关键字：RHEOLOGICAL,PROPERTIES,MODIFICATION,ENGINEERING,RESINS,USING,ULTRA,HIGH,MOLECULAR,WEIGHT,ADDITIVES,
In this work, blends of engineering polymers with ultra-high molecular weight additives were prepared at 200°C using a DSM micro-compounder.
http://www.polymer.cn/research/dis_info3323 |
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RHEOLOGICAL PROPERTIES MODIFICATION OF ENGINEERING RESINS USING ULTRA-HIGH MOLECULAR WEIGHT ADDITIVES
关键字：RHEOLOGICAL,PROPERTIES,MODIFICATION,ENGINEERING,RESINS,USING,ULTRA,HIGH,MOLECULAR,WEIGHT,ADDITIVES,
In this work, blends of engineering polymers with ultra-high molecular weight additives were prepared at 200°C using a DSM micro-compounder.
http://www.polymer.cn/research/dis_info3323 |
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Zno Quantum-dot Modified Silicone Resins with Tunable Luminescence and High Refractive Index
关键字：Quantum-dot, Silicone, Luminescence, Refractive index
Due to their high power efficiency, good reliability and long lifetime, etc, solid state lighting emitting diodes (LEDs) have attracted great interests for general illuminationcl]. In conventional low-power LED technology,&nb...
http://www.polymer.cn/research/sy_info15180 |
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UV-curable epoxy systems containing hyperbranched polymers: Kinetics investigation by photo-DSC
关键字：Epoxy resins,Photopolymerization,Photocalorimetry
The effect of the presence of a hyperbranched OH-functionalized polymer (HBP) on the kinetics of cationic photopolymerization of an epoxy system was investigated employing two complementary techniques, photo-DSC and real-time FT-IR spectroscopy....
http://www.polymer.cn/research/ct_info934 |
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Rheological Properties of PEPA End-capped Polyimide Resins based on Isomeric HQDPAs
关键字：Rheological Properties, PEPA, Polyimide
This is a continuation of our series work on “Isomeric Polyimide”. NASA Langley Research Center in USA has reported excellent work on phenylethylyl end-capped aromatic polyimides based on 3,3’,4,4’-bipnehyl dianhydride (4,4’-BPDA) and ...
http://www.polymer.cn/research/ct_info850 |
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ZnO Quantum-dot Modified Silicone Resins with Tunable Luminescence and High Refractive Index
关键字：quantum-dot, silicone, luminescence, refractive index
Due to their high power efficiency, good reliability and long lifetime, etc, solid state lighting emitting diodes (LEDs) have attracted great interests for general illuminationcl]. In conventional low-power LED technology,&nb...
http://www.polymer.cn/research/dis_info17245 |
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Bis-benzoxazine resins with high char yield and toughness modified by hyperbranched poly(resorcinol borate)
A bis-benzoxazine (BZ) resin which displays low viscosity, good processabilities, high thermal resistance and mechanical properties has been developed in recent years, and can be used in the resin transfer molding technique .
http://www.polymer.cn/research/dis_info16551 |
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The Influence of a Constant Magnetic Field on Structure,Specific Density and Electrical Conduction of Modified Epoxy Resins
关键字：Epoxy Resins
Physical modification of polymers and polymer composites is an effective remedy of the regulation of their structure and properties. Therefore, it is important, both with scientific and practical points of view toinvestigate influence ...
http://www.polymer.cn/research/dis_info9142 |
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Cryogenic Mechanical Properties of Multi-Walled Carbon Nanotube Reinforced Epoxy CompositesNanotube Reinforced Epoxy Composites
关键字：Epoxy resins
Epoxy resins are widely applied in cryogenic engineering and their cryogenic mechanical properties as important parameters have to be improved to meet the highrequirements by cryogenic engineering applications.
http://www.polymer.cn/research/dis_info9038 |
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Rheological Properties of PEPA End-capped Polyimide Resins based on Isomeric HQDPAs
关键字：Rheological Properties, PEPA, Polyimide
This is a continuation of our series work on “Isomeric Polyimide”. NASA Langley Research Center in USA has reported excellent work on phenylethylyl end-capped aromatic polyimides based on 3,3’,4,4’-bipnehyl dianhydride (4,4’-BPDA) and ...
http://www.polymer.cn/research/dis_info8634 |
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