作者：Ke Zhao, Siyu Wei, Ming Cao, Meng Wang, Pengfei Li, Hao Li, Xianglin Zhang, Yuanyuan Zhang, Yingbo Chen*
关键字：Polyimide composites; Thermal conductivity; Electrical insulation
论文来源：期刊
具体来源：Composites Science and Technology 245 (2024) 110323
发表时间：2024年

Composites Science and Technology 245 (2024) 110323

DOI: 10.1016/j.compscitech.2023.110323

With the continuous development of electronic technology, polymer-based thermal management materials (TMMs) with insulation, high thermal conductivity (TC), and low dielectric performance are urgently needed for electronic devices. Nevertheless, balancing above expected properties is still a daunting challenge because of phonon scattering and interfacial polarization. Here we put forward a simple and useful method for preparing polyimide (PI) composites. First, the alignment of modified boron nitride nanosheet (MBN) along the fiber was controlled by electrospinning, while silver nanowire (AgNW) was utilized for electrostatic spraying to overlap the AgNW with MBN. Finally, a hybrid network oriented along the horizontal direction was formed by hot-pressing. The in-plane TC of the PI composites was up to 8.38 W/mK due to the formation of thermal conduction pathways along the hybrid network. The PI composites also had a series of merits, such as electrical insulation of over 2.40 × 10^14 Ω cm, low dielectric constant (3.84), low dielectric loss (<0.01) at 10^6 Hz, excellent thermal stability (THRI = 299.3 °C), and heat dissipation capability. These PI composites with satisfactory comprehensive properties have great application potential in electronic devices, particularly in flexible electronic devices or circuits that demand electrical insulation and high TC.