相关链接
联系方式
  • 通信地址:陕西省西安市友谊西路127号
  • 邮编:710072
  • 电话:029-88431638
  • 传真:
  • Email:nwpugjw@163.com
当前位置:> 首页 > 精彩瞬间 > 正文
SFPC课题组第99篇论文发表在ACS Applied Materials & Interfaces上

Tengbo Ma#, Yongsheng Zhao#, Kunpeng Ruan, Xirui Liu, Junliang Zhang, Yongqiang Guo, Xutong Yang, Jie Kong and Junwei Gu*. Highly Thermal Conductivities, Excellent Mechanical Robustness and Flexibility, and Outstanding Thermal Stabilities of Aramid Nanofiber Composite Papers with Nacre-Mimetic Layered Structures. ACS Applied Materials & Interfaces, 2020, 12(1): 1677-1686. 2018IF=8.456. (1区/Top期刊:工程技术领域顶尖期刊).

Abstract: Aramid nanofiber (ANF) paper has shown potential applications in flexible electronics. However, its inherent low thermal conductivity coefficient (λ) values might threaten the safety of devices under a high-power working condition. In this work, polydopamine-functionalized boron nitride nanosheet (BNNS@PDA)/ANF thermally conductive composite papers with nacre-mimetic layered structures were prepared via highly efficient vacuum-assisted filtration followed by hot pressing. For a given BNNS loading, the surface functionalization of BNNS could further enhance the thermal conductivities and mechanical properties of BNNS@PDA/ANF composite papers. BNNS@PDA/ANF composite papers presented anisotropic thermal conductivities, and the through-plane (λ⊥) and in-plane (λ∥) values of the 50 wt % BNNS@PDA/ANF composite papers reached 0.62 and 3.94 W/mK, 181.8 and 196.2% higher than those of original ANF paper, respectively, which were also higher than those of 50 wt % BNNS/ANF composite papers (λ⊥ = 0.52 W/mK and λ∥ = 3.33 W/mK). The tensile strength of the 50 wt % BNNS@PDA/ANF composite papers reached 36.8 MPa, 30.5% higher than that of 50 wt % BNNS/ANF composite papers (28.2 MPa). In addition, the heat resistance index (THRI) of the 50 wt % BNNS@PDA/ANF composite papers was further increased to 223.1 °C. Overall, our fabricated BNNS@PDA/ANF composite papers possess highly thermal conductivities, excellent mechanical robustness and flexibility, and outstanding thermal stabilities, showing great potential applications in the fields of intelligent wearable equipment, flexible supercapacitors, and flexible electronics.