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SFPC课题组导热高分子材料前瞻性论述发表在Nano-Micro Letters上

Junwei Gu*, Kunpeng Ruan. Breaking Through Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics. Nano-Micro Letters, 2021, 13: 110. 2019IF=12.264.

https://link.springer.com/article/10.1007/s40820-021-00640-4

Abstract

Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible direction for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance (ITR) in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.

能源、电气和电子技术的高速发展对高分子及其复合材料的导热性能提出了更高的要求。然而,目前制备的导热高分子复合材料的导热系数(λ)大多仍然难以达到预期,已成为导热高分子复合材料领域内一大瓶颈问题。针对此,本文基于相关研究者与本课题组前期研究工作的积累,提出了突破瓶颈的三个可能方向——制备合成本征型导热高分子材料、降低导热高分子复合材料中的界面热障以及建立并研究合适的导热模型与机理指导实验优化,并对三个方向未来的发展趋势进行前瞻,希冀为导热高分子及其复合材料的制备、研究与发展提供一定的依据与指导。