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SFPC课题组电磁屏蔽复合材料综述论文发表在SusMat上

Lei Wang#, Zhonglei Ma#, Yali Zhang, Lixin Chen*, Dapeng Cao and Junwei Gu*. Polymer-based EMI shielding composites with 3D conductive networks: A mini-review. SusMat, 2021, 1(3): 413-431.(中国科技期刊卓越行动计划高起点新刊)

https://doi.org/10.1002/sus2.21

Abstract

High-frequency electromagnetic waves and electronic products can bring great convenience to people''s life, but lead to a series of electromagnetic interference (EMI) problems, such as great potential dangers to the normal operation of electronic components and human safety. Therefore, the research of EMI shielding materials has attracted extensive attention by the scholars. Among them, polymer-based EMI shielding materials with light weight, high specific strength and stable properties have become the current mainstream. The construction of 3D conductive networks has proved to be an effective method for the preparation of polymer-based EMI shielding materials with excellent shielding effectiveness (SE). In this paper, the shielding mechanism of polymer-based EMI shielding materials with 3D conductive networks is briefly introduced, with emphasis on the preparation methods and latest research progress of polymer-based EMI shielding materials with different 3D conductive networks. The key scientific and technical problems to be solved in the field of polymer-based EMI shielding materials are also put forward. Finally, the development trend and application prospects of polymer-based EMI shielding materials are prospected.

高频电磁波和电子产品在带给人们生活便利的同时,也导致一系列电磁干扰(EMI)问题,给电子元器件的正常运作和人类安全及健康带来巨大的隐患。轻质、比强度高和性质稳定的聚合物基电磁屏蔽材料已成为当前的主流。构建3D导电网络被证明是一种制备优异屏蔽效能(SE)聚合物基电磁屏蔽材料的有效方法。本文简述了3D导电网络聚合物基电磁屏蔽材料的屏蔽机理,重点介绍了3D导电网络聚合物基电磁屏蔽材料的制备方法以及基于多种不同结构的3D导电网络制备电磁屏蔽材料的最新研究进展。提出了聚合物基电磁屏蔽材料领域中亟待解决的关键科学和技术问题,最后展望了聚合物基电磁屏蔽材料未来的发展趋势和应用前景。