writer：Xutong Yang#, Chaobo Liang#, Tengbo Ma, Yongqiang Guo, Jie Kong, Junwei Gu*, Minjiao Chen and Jiahu
keywords：Thermally conductive polymeric composites; Measurement methods; Model & equations; Mechanism.
source：期刊
specific source：Advanced Composites and Hybrid Materials
Issue time：2018年

With the fast-developing miniaturization and integration of microelectronics packaging materials, ultra high voltage electrical devices, light-emitting diodes (LEDs) and in areas which require good heat dissipation and low thermal expansion, the investigations on the polymeric composites with highly thermal conductivities and excellent thermal stabilities are urgently required, which would be beneficial to transferring the heat to the outside of the products, finally to effectively avoid substantial overheating and prolong their working life. Our article reviews recent progress in the classification, measurement methods, model & equations, mechanisms, commonly used thermally conductive fillers and the correlative fabrication methods for the thermally conductive polymeric composites, aiming to understand and grasp how to enhance the λ value effectively. And future perspectives, focusing scientific problems and technical difficulties of the present thermally conductive polymeric composites are also described and evaluated.