writer：Chaofan Wang, Yusheng Tang*, Yuxiao Zhou, Yanyao Zhang, Jie Kong, Junwei Gu, Junliang Zhang*
keywords：Cyanate ester resins
source：期刊
specific source：Polymer Chemistry
Issue time：2021年

Cyanate ester resins are widely utilized in high-performance printed circuit boards, radar radomes, communication satellites, and other fields. However, the poor toughness after curing due to the highly cross-linked and symmetrical triazine ring structure severely limits their wide application. Herein, a novel epoxy-terminated and fluorine-containing polyaryletherketone (EFPAEK) synthesized from bisphenol AF, difluorobenzophenone, and epichlorohydrin was applied to modify the bisphenol A dicyanate ester (BADCy) resin. The results showed that the EFPAEK/BADCy resin toughened with 20 wt% of EFPAEK displayed the best comprehensive properties. The dielectric constant and the dielectric loss tangent values at 1 MHz were 2.64 and 0.006, respectively, which were much lower than those of the pure BADCy resin (3.09 and 0.008). In addition, the flexural strength and impact strength of the corresponding EFPAEK/BADCy resin increased significantly to 131.8 MPa and 30.6 kJ m^-2, respectively, which were 32.5% and 159.3% higher compared to the pure BADCy resin (99.5 MPa and 11.8 kJ m^-2). Besides, the modified BADCy resin still maintained high thermal stability, by showing the highest heat resistance index of 219.5℃, which increased by 4.2% compared with the pure BADCy resin (210.6℃). Moreover, the addition of EFPAEK improved the bonding strength. The maximum bonding strength of the EFPAEK/BADCy resin was 22.2 MPa, which was 91.4% higher compared to that of the pure BADCy resin (11.6 MPa). Additionally, the EFPAEK/BADCy resin demonstrated improved water resistance as the minimum water absorption rate decreased by 30.9% compared to that of the pure BADCy resin.

氰酸酯树脂广泛应用于高性能印刷电路板、雷达天线罩、通信卫星等领域。然而，由于高度交联的对称三嗪环结构，固化后的氰酸脂树脂韧性较差，严重限制了其广泛应用。本文以双酚AF、二氟二苯甲酮和环氧氯丙烷为原料合成了一种端基为环氧基且主链含氟的聚芳醚酮（EFPAEK），并将其用于改性双酚A氰酸脂树脂（EFPAEK/BADCy）。结果表明，1 MHz下，当EFPAEK的质量分数为20 wt%时，EFPAEK/BADCy树脂具有最佳的综合性能。其介电常数（ε）和介电损耗角正切值（tanδ）分别为2.64和0.006（均低于纯BADCy的ε和tanδ，3.09和0.008）；弯曲强度和冲击强度分别为131.8 MPa和30.6 kJ m^-2，较纯BADCy树脂的弯曲强度（99.5 MPa）和冲击强度（11.8 kJ m^-2）分别提高了32.5%和159.3%。同时，改性后的BADCy树脂仍保持了较高的热稳定性，其最高耐热指数为219.5℃，比纯BADCy树脂（210.6℃）提高了4.2%。EFPAEK的加入也提高了粘接强度。EFPAEK/BADCy树脂的最大粘结强度为22.2 MPa，比纯BADCy树脂（11.6 MPa）提高了91.4%。此外，EFPAEK/BADCy树脂具有较好的耐水性，其最小吸水率与纯BADCy树脂相比降低了30.9%。