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SFPC课题组电磁屏蔽复合材料工作发表在Small Structures上

Bo Zhao, Zhonglei Ma*, Yuyao Sun, Yixuan Han and Junwei Gu*. Flexible and Robust Ti3C2Tx/(ANF@FeNi) Composite Films with Outstanding Electromagnetic Interference Shielding and Electrothermal Conversion Performances. Small Structures, 2022, 3(10): 202200162. 2021IF= 11.343.(1区材料科学Top期刊)https://onlinelibrary.wiley.com/doi/10.1002/sstr.202200162

Abstract

Flexible and robust multifunctional electromagnetic interference (EMI) shielding materials are playing an increasingly important role in areas of aerospace, electronic communication, artificial intelligence and wearable electronic devices. In this work, the magnetic and conductive Ti3C2Tx/(ANF@FeNi) EMI shielding composite films are fabricated via the in-situ growth and vacuum assisted filtration methods. The introduction of magnetic FeNi nanoparticles can effectively enhance the electromagnetic recombination losses, leading to the improved electromagnetic interference shielding effectiveness (EMI SE) of the composite films. The obtained Ti3C2Tx/(ANF@FeNi) composite films show excellent EMI shielding and electrothermal conversion performances. When the mass fraction of Ti3C2Tx and FeNi fillers is 60 wt% and their mass ratio is 4:1, the EMI SE of the composite films (50 μm) reaches 60.7 dB in X-band (8.2-12.4 GHz). When applied a low voltage of 3 V, the surface heating temperature of the composite films quickly reaches 111.2°C. Moreover, the composite films possess a satisfied long-term heating stability under the constant applied voltage. In addition, the composite films exhibit excellent thermal conductivity and mechanical properties.The thermal conductivity (λ) and thermal diffusivity (α) reach 4.72 W/(m·K) and 4.36 mm2/s, respectively, and the tensile strength and tensile modulus reach 113.4 MPa and 3.1 GPa, respectively.


高强度且多功能柔性电磁干扰(EMI)屏蔽材料在航空航天、电子通信和人工智能等领域发挥越来越重要的作用。本文采用原位生长法在芳纶纳米纤维(ANFs)表面负载FeNi纳米合金粒子制备磁性ANF@FeNi,进一步与高导电Ti3C2Tx纳米片层复合,借助真空辅助抽滤技术制备磁性导电Ti3C2Tx/(ANF@FeNi)电磁屏蔽复合膜。磁性FeNi纳米合金粒子的引入能够有效增强电磁复合损耗,提升复合膜的电磁屏蔽效能(EMI SE)。Ti3C2Tx/(ANF@FeNi)电磁屏蔽复合膜表现出优异的电磁屏蔽和电热转化性能。当Ti3C2TX和FeNi填料质量分数为60 wt%、质量比为4:1时,复合膜(50 μm)在X波段(8.2-12.4 GHz)的EMI SE为60.7 dB。当外施电压为3 V时,复合膜的表面发热温度可以快速达到111.2oC,且在恒定外施电压下具有良好的长时间发热稳定性。此外,复合膜还具有突出的导热和力学性能,其热导率(λ)和热扩散率(α)分别为4.72 W/(m·K)和4.36 mm2/s,拉伸强度和拉伸模量分别达到113.4 MPa和3.1 GPa。


本文亮点

1. 采用“原位生长-真空辅助抽滤”法成功制备出磁性导电Ti3C2Tx/(ANF@FeNi)电磁屏蔽复合膜。当Ti3C2TX和FeNi(质量比为4:1时)的质量分数为60 wt%时,复合膜(50 μm)在X波段(8.2-12.4 GHz)的EMI SE达到60.7 dB。

2. Ti3C2Tx/(ANF@FeNi)电磁屏蔽复合膜具有优异的电热转化和快速响应特性。当外施电压为3 V时,复合膜的表面发热温度可以快速达到111.2oC且在恒定外施电压下具有良好的长时间发热稳定性。

3.Ti3C2Tx/(ANF@FeNi)电磁屏蔽复合膜具有卓越的导热性能和力学性能。当Ti3C2Tx和FeNi(质量比为4:1时)的质量分数为60 wt%时,复合膜的λ和α分别为4.72 W/(m·K)和4.36 mm2/s,其拉伸强度和拉伸模量也分别达到113.4 MPa和3.1 GPa。


第一作者:赵博

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