Thermally conductive polymer composites have become a research hotspot and an important branch in the fields of thermal conduction such as 5G communication equipment, electronic packaging and energy transmission due to their light weight, easy processing and low manufacturing cost, etc. However, the thermal conductivity coefficients (λ) of reported thermally conductive polymer composites are far from expected, and one of the most important reasons is the inherent interfaces between phases in the polymer composites and the high interfacial thermal resistance (ITR). This review summarizes the research history and the latest progress of ITR in thermally conductive polymer composites from 4 aspects: mathematical models, computer simulations, measurement techniques and strategies to reduce ITR. Furthermore, the problems of researches on ITR in urgent need for solution as well as corresponding possible solutions are illuminated, hoping to provide some guiding suggestions for the rapid and efficient improvement on λ of thermally conductive polymer composites.聚合物基导热复合材料由于具有轻质、易成型加工、低制备成本等诸多优点，已成为5G通讯设备、电子封装和能量传输等导热领域的研究热点和重要分支。然而现有聚合物基导热复合材料的导热系数（λ）远低于预期值，其中一个重要的原因在于聚合物基复合材料固有的相界面以及较高的界面热障。本文从界面热障的数学模型、计算机模拟、测量方法以及降低界面热障的策略4个方面对聚合物基导热复合材料界面热障的研究历史与最新进展进行总结，阐明了聚合物基导热复合材料领域目前亟需解决的界面热障问题以及可能的解决方法，希冀为聚合物基导热复合材料λ的快速高效提升提供一些指导性的建议。