作者：Kunpeng Ruan, Yuanyuan Tian, Yujia Tian, Mukun Li, Kun Zhou*, Junwei Gu*
关键字：Direct ink writing; 3D printing, Colonnade-structure, Thermal interface materials, Thermal conduction pathways
论文来源：期刊
发表时间：2026年

Kunpeng Ruan, Yuanyuan Tian, Yujia Tian, Mukun Li, Kun Zhou*, Junwei Gu*. Architecting optimized thermal conduction pathways in colonnade-structured polydimethylsiloxane-based thermal interface materials by direct ink writing. Science Bulletin, 2026, 10.1016/j.scib.2026.03.011. 2024IF=21.1.（1区综合类Top期刊，中国科技期刊卓越行动计划-领军类期刊项目）

https://doi.org/10.1016/j.scib.2026.03.011

Abstract

The rapid rise in chip heat generation places increasing demands on thermal interface materials (TIMs), requiring higher thermal conductivity and more efficient thermal conduction pathways. Here, we introduce a new design strategy for TIMs that directs heat transfer in three stages: horizontal distribution, vertical transfer, and horizontal dissipation. Using the direct ink writing three-dimensional printing technique, we fabricate polydimethylsiloxane (PDMS)-based TIMs with a colonnade-inspired architecture. The top and bottom “corridors” are formed from a boron nitride nanosheet (BNNS)/PDMS composite, where BNNS fillers are aligned in the in-plane direction to enhance lateral heat conduction. The central “pillar” layer is composed of a reduced graphene oxide (rGO)/PDMS composite, with rGO fillers aligned in the through-plane direction to promote vertical heat transfer. Compared with conventional PDMS-based TIMs containing randomly dispersed fillers or sandwich structures with only in-plane alignment, our prepared colonnade-structured PDMS-based TIMs demonstrate significantly improved thermal conductivity and reduced thermal resistance for interfaces.

高性能芯片正向小型化、集成化和高处理速度的方向快速发展，随之带来芯片发热量急剧增加的问题，进而对热界面材料（TIMs）的导热性能和散热效率提出了更高的要求。TIMs的导热性能和散热效率的核心在于导热通路设计，然而常规的单向导热通路设计已无法满足高散热需求，需要对TIMs内导热通路进行进一步优化。本文提出先水平均热、再垂直传热、最后水平散热的导热通路设计理念，利用墨水直写（DIW）3D打印技术制备了具有柱廊结构的聚二甲基硅氧烷（PDMS）基TIMs：其顶面和底面为“廊”，由氮化硼纳米片/PDMS（BNNS/PDMS）导热复合材料组成，其中BNNS填料沿面内方向取向；中间层为“柱”，由还原氧化石墨烯/PDMS（rGO/PDMS）导热复合材料组成，其中rGO填料沿面间方向取向。相比填料随机分散的无序结构PDMS基TIMs和填料均面内取向的三明治结构PDMS基TIMs，本文制备的柱廊结构PDMS基TIMs具有更为优异的导热性能和更低的界面热阻。此外，柱廊结构PDMS基TIMs还具有优异的电绝缘性能和日间被动辐射冷却性能，使其在新能源汽车电池组、户外高压设备等应用场景下也具有巨大的潜力。