writer：Binyuan Liu, Yang Li, Anu Stell Mathews, Yige Wang, Weidong Yan, Sinoj Abraham, Chang-Sik Ha, Da
keywords：Low-k materials, Polynorbornene with Cyclic Pendant Imide Side Groups
source：期刊
specific source：React Function Polym, 2008, 68, 1619-1624.
Issue time：2008年

A set of functionalized polynorbornenes with various substituted pendant imide groups (Nsubstituent imide group = adamantyl, cyclohexyl, tolyl, and phenyl) have been prepared via vinylic pathway by using di-l-chloro-bis-(6-methoxybicyclo[2.2.1]-hept-2-ene-endo- 5r,2p)-palladium(II) catalyst as a means of developing materials for low dielectric constant. The effects of molar ratio of monomer to catalyst, solvent polarity, reaction time, and temperature on the polymerization of substituted norbornene-5,6-dicarboximide were investigated. Among the monomers used, exo-N-cyclohexyl-norbornene-5,6-dicarboximide recorded the highest activity, giving 90% conversion in 30 min. All the resulting functionalized polynorbornenes are characterized by good thermal properties (5% weight loss at 440 ^oC) and low dielectric constants (2.26–2.53), which are desirable for the next generation
 of microprocessors and memory for computers to provide insulation in the increasingly shrinking feature sizes of faster microprocessors.