writer：Longtao Wang, Haoyang Jin, Fengyuan Zhang* and Songqi Ma*
keywords：低介电，高分子
source：期刊
specific source：ACS Appl. Mater. Interfaces
Issue time：2026年

With the rapid advancement of microelectronics technology and artificial intelligence, electronic devices are undergoing rapid evolution toward high integration, miniaturization, and multifunctionality. However, this development trend has also brought about a series of technical challenges, such as signal transmission delay, crosstalk interference, and increased power consumption. Against this backdrop, the research and development of low-dielectric constant materials hold significant strategic importance. Particularly, the demand for high-performance low-dielectric resins has become particularly urgent with rapid development of high-speed and high-frequency electronic devices. Low-dielectric resins exhibit important application values in multiple key fields owing to their unique performance advantages. This paper systematically reviews the main types of low-dielectric resins, focusing on the research progress of traditional materials such as epoxy resins, polyimides, liquid crystal polymers, and other low-dielectric polymers. By deeply analyzing their dielectric property regulation mechanisms and preparation process optimization strategies, this paper elaborates on the practical applications of these materials in modern electronic devices, communication systems, aerospace equipment, defense technology, and energy technologies. Based on systematic research from molecular structure design to macroperformance optimization, this paper summarizes the latest research achievements in this field and prospects the future development directions, aiming to provide theoretical foundations and technical references for material research and development as well as engineering applications in related fields.

全文链接：https://doi.org/10.1021/acsami.5c24084