当前位置:群英聚首 > 论文著作 > 正文
Multifunctional Flexible WPU Composite Aerogels with Sandwich Structure for Dual-Sided Low-Reflection Electromagnetic Interference Shielding
来源:王雷教授个人网站 发布日期:2026-03-30
作者:[5] Xiaofeng Hu, Yali Zhang, Hua Guo, Mukun He, Hua Qiu, Xuetao Shi, Lei Wang*, Junwei Gu*.
关键字:electricalconductivity | electromagneticinterferenceshielding | liquidmetal | silvernanowires | thermalmanagement
论文来源:期刊
具体来源:Advanced Functional Materials
发表时间:2025年

With the increasingly severe electromagnetic pollution, the demand for

low-reflection electromagnetic interference shielding (EMI) materials has

become progressively urgent. Based on the layered design, the

(MXene@CoFe2O4/waterborne polyurethane

(WPU))-(MXene/WPU)-(MXene@CoFe2O4/WPU) composite aerogels with

sandwich structure (SWCA) are prepared by layer freezing and freeze-drying

method, using WPU as the matrix and heterostructure MXene@CoFe2O4

prepared by solvothermal reduction as electromagnetic filler. When the mass

ratio of MXene to CoFe2O4 is 1:6, MXene@CoFe2O4 exhibits optimal

impedance matching (with the value of |Zin/Z0| closer to 1). Due to the

synergistic effect between the absorbing layer of MXene@CoFe2O4/WPU

aerogels and the reflecting layer of MXene/WPU aerogels, SWCA assembled

with 80 wt.% MXene/WPU aerogels and 40 wt.% MXene@CoFe2O4-3/WPU

aerogels achieve high EMI shielding effectiveness (77 dB) and low reflection

(0.14) in the X band. Besides, SWCA demonstrates dual-sided low-reflection

EMI shielding performance, to the extent that in practical applications, they

are no longer restricted to specific installation directions. Moreover, SWCA

shows high compressive stress (maximum compressive stress of 264.0 kPa at

50% compressive strain), compressive resilience (88% resilience after 100

cycles of compression), excellent thermal insulation (thermal conductivity

between 0.0843 and 0.0941 W (m·K)?1) and infrared camouflage performance.

The multifunctional flexible EMI shielding aerogels with low reflection and

high performance holds great promise for application prospect in

next-generation electronic devices.


Copyright © 2005 Polymer.cn All rights reserved
中国聚合物网 版权所有
经营性网站备案信息

京公网安备11010502032929号

工商备案公示信息

京ICP证050801号

京ICP备12003651号