writer：Zhi-Qi Cai, Dong-ming Qi, Jianzhong Sun, Hua Ren, Qian Zhao and Qiyun Zhou
keywords：Curing, Kinetics, Liquid crystalline epoxy resin, Rigid-rod epoxy
source：期刊
specific source：Polymer-Plastics Technology and Engineering, 47: 1105-1108
Issue time：2008年

    The cure kinetics of a rigid-rod epoxy monomer, diglycidyl ether of 4,40-bisphenol (DGEBP), and the curing agent with the similar rigid-rod group, 4,40-diaminebiphenyl (DABP), was studied using an advanced isoconversional method (AICM). DGEBP/DABP curing system was carried out by means of differential scanning calorimetry (DSC). Three exothermic peaks were depicted by nonisothermal DSC studies: the first two peaks were attributed to the curing reaction, and the last peak was attributed to the decomposition of the cured epoxy resin. The LC phase transformation of the curing process was observed by PLM. Using AICM,  the largest activation energy of the curing reaction of DGEBP/DABP system was obtained as 108 kJ/mol. It can also be learned that LC phase transformation of the curing process affects the reaction significantly.