作者：[1] Zelong Yang, Weining Ren, Li Lang, Ruimin Wang, Jiarui Hu, Lei Wang*
关键字：electricalconductivity | electromagneticinterferenceshielding | liquidmetal | silvernanowires | thermalmanagement
论文来源：期刊
具体来源：Advanced Functional Materials
发表时间：2026年
Developingelectromagneticinterference(EMI)shieldingmaterialsthatcombinehighshieldingefficiencywithelectricalinsulationforelectronicpackagingremainsacriticalchallenge.Inthiswork,multifunctionalmultilayercompositefilmscomprisingsilvernanowires(AgNWs),liquidmetal(LM),andaramidnanofibers(ANF)withaslipperysurface(ALAFS)arefabricatedviaanintegratedstrategyoflayeredvacuumfiltration,hotpressing,andscrapercoating.WithanoptimizedAgNWs:LMratioof2:1andaloadingof60wt.%,theAgNWs@LM/ANFfilmspresentarecord-breakingelectricalconductivityofupto2.1×104S/cm.Aftercoatingtheinsulatinglayer,theALAFSdemonstratesanultrahighEMIshieldingeffectiveness(SE)of92dBandmaintainsexcellentelectricalinsulationwithavolumeresistivityof1.13×1015Ω?cm,effectivelymitigatingshort-circuitrisks.TheEMISEremainssuperior(>90dB)evenunderextremeenvironmentalconditions.Furthermore,theALAFSexhibitsahighin-planethermalconductivity(λ)of15.9W/(m?K)foreffectiveheatdissipationandrobustmechanicalpropertieswithatensilestrengthof176MPa.Synergizingsurfacehydrophobicitywiththeinternalconductivenetwork,ALAFSalsooffersefficientanti-frostandde-icingcapabilities.Insummary,ALAFSprovidesacomprehensivesolutionforthepackagingandthermalmanagementofnext-generationflexibleelectronicsincomplexenvironments.