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您现在的位置:中国聚合物网 > 全站 > MIT Technology Review 的搜索结果 共有结果273,当前从第51条到第60条,本次搜索耗时0.2187705
 
New Advances in Elastomer Nanocomposite Technology
Nanocomposite technology offers the potential to provide a platform for the next incremental improvement in tire performance.
http://www.polymer.cn/research/dis_info12036
 
From Nano- to Mega-Technology of Elastomers
关键字:Nanotechnology
Recently, there have been so many studies on nanotechnologyand nano-science. The situation is almost the samefor polymer nanotechnology and rubber or elastomernanotechnology in narrower sense. However, most ofthese studies have not been use...
http://www.polymer.cn/research/dis_info9262
 
From Nano- to Mega-Technology of Elastomers
关键字:Nanotechnology

http://www.polymer.cn/Industry/industry2562.html
 
MIT赵选贺团队招收活体动物实验博士后
关键字:MIT,博士后
In vivo postdoctoral fellow positions in Zhao Lab at MIT Prof. Xuanhe Zhao’s laboratory at Massachusetts Institute of Technology (zhao.mit.edu) is looking for TWO highly motivated postdoctoral fellows for in vivo studies of advanced soft materials in the areas of bioadhesives, bioelectronics, and biomaterials in general. The following in vivo studies are ex...
http://www.polymer.cn/sci/kjxw15503.html
 
Advances in Ordered Polymer-based Composites
关键字:Polymer composites, Ordering structure, Review
    Ordered polymer-based composites are a new class of materials with periodical structure or orientation of one or more phases, and have attracted much interest in polymer science and industries due to their wide ...
http://www.polymer.cn/research/sy_info15217
 
Advances in Polymer Nanocomposites for Electronic Packaging
关键字:Polymer nanocomposites, Electronic packaging, Review
    Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115
 
Advances in Polymer Nanocomposites for Electronic Packaging
关键字:Polymer nanocomposites, Electronic packaging, Review
    Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114
 
Advances in Ordered Polymer-based Composites
关键字:Polymer composites, Ordering structure, Review
    Ordered polymer-based composites are a new class of materials with periodical structure or orientation of one or more phases, and have attracted much interest in polymer science and industries due to their wide ...
http://www.polymer.cn/research/dis_info17364
 
Advances in Polymer Nanocomposites for Electronic Packaging
关键字:polymer nanocomposites, electronic packaging, review
    Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187
 
Advances in Ordered Polymer-based Composites
关键字:Polymer composites, Ordering structure, Review
    Ordered polymer-based composites are a new class of materials with periodical structure or orientation of one or more phases, and have attracted much interest in polymer science and industries due to their wide ...
http://www.polymer.cn/research/sy_info15217
 
 
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