Advances in Polymer Nanocomposites for Electronic Packaging-中国聚合物网,论文下载

Advances in Polymer Nanocomposites for Electronic Packaging

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Polymer nanocomposites Electronic packaging Review

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功能高分子

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Chipsbasedonintegratedcircuits(ICs)havebeenwidelyusedintheelectronicinformationindustry,andtheflip-chiptechnologybasedonunderfillprocessisbecomingamostpromisingpackagingmethodduetothecontinuousdesireforfaster,thinnerandlighterpackages.However,oneofthemainbottlenecksistodesignandmanufactureelectronicpackagingmaterialswithexcellentthermalconductivity(atleastiW/(m.K》,highelectricalinsulation,lowviscosity《20kcpsat250C)andcoefficientofthermalexpansion《20一30)X10-6/oC).Epoxyresinsaregenerallyusedinmanyelectronicpackagingapplications,buttheirlowthermalconductivitypresentsamajordrawback.Thus,highintrinsicthermalconductivesolidfillers,e.g.,metalpowders,carbonfibers,graphite,diamond,ceramicparticlesandwhiskershavebeenincorporatedintoepoxyresins.However,suchcompositeseithercannotmeetthestringentrequirementsforelectricalinsulationorneedveryhighfillerloading(upt070vol%)toachievethenecessarythermalconductivityattheexpenseofprocessingproblemsandreducedmechanicalproperties.Recently,carbonnanotubes(CNTs)andgraphenes(GRs)haveunusuallyhighthermalconductivityowingtothephonon-dominatedballisticheattransport;therefore,theirpolymernanocompositesareexpectedtoprovideabreakthroughintheirapplicationsinthermalmanagement.But,inpractice,theenhancementonthermalconductivityofpolymernanocompositesdoesnotmatchthesepredictionsbecauseofthehighthermalinterfacialresistanceoriginatedfromthestronginterfacialphononscattering.Theincreasedelectricalconductivityalsolimitstheirapplications.Inthispaper,recentadvancesinpolymernanocompositesforelectronicpackagingarereviewed.

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2013-06-21 13:48:48

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