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Numerical Approach to Visco-Plastic Lubrication
Multi-layer shear flows have broad range of application in industry such as Co-extrusion processes and lubricated pipelining.
http://www.polymer.cn/research/dis_info12635 |
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Numerical Approach to Visco-Plastic Lubrication
Multi-layer shear flows have broad range of application in industry such as Co-extrusion processes and lubricated pipelining.
http://www.polymer.cn/research/dis_info12635 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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Electrospun Antimicrobial Polylactic Acid/Tea Polyphenol Nanofibers for Food-Packaging Applications.
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http://www.polymer.cnt//ss/liuyaowen/publicationsshow_13335.html |
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BIODEGRADABLE LOW DENSITY POLYETHYLENE (LDPE)/TAPIOCA STARCH PACKAGING FILMS
关键字：BIODEGRADABLE,LOW,DENSITY,POLYETHYLENE,LDPE,TAPIOCA,STARCH,PACKAGING,FILMS,
Worldwide production of plastics is more than 78 million tons per year and almost half of that discarded within short time, remaining in garbage deposits and landfills for decades (more than 30 years) [1].
http://www.polymer.cn/research/dis_info5850 |
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