Development of a Thermal-Electric Analog Method to Measure Thermal Conductivity of High Performance and High Temperature Resistant Materials，2005年新型纤维与聚合物材料国际学术会议（10.19-10.21，上海）-中国聚合物网,论文下载

Development of a Thermal-Electric Analog Method to Measure Thermal Conductivity of High Performance and High Temperature Resistant Materials

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Thermal-Electric Analog Method Measure Thermal Conductivity of
High Performance and High Temperature Resistant Materials

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分子表征

来源：

2005年新型纤维与聚合物材料国际学术会议（10.19-10.21，上海）

简介：

Anovelmethodbasedonthethermal-electricanalogprincipleisdescribedinthestudytomeasurethethermalconductivityofvarioushighperformanceandhightemperatureresistantmaterials.Also,athermalsimulatingboxisdesignedaccordingtothenewmethod.Thecoldsideofthetestsampleismaintainedaroundlowtemperatureashighas36℃,howeverthehotsidewasexposedtodryhotair.Resultsshowthatthemaximiumofairgapintheboxislimitedtoacertainvaluewithdifferenthotplatetemperatureandairpressurehaveminoreffectsonthemeasuredvaluesofthermalconductivity.

作者：

Fanglong Zhu Weiyuan Zhang

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2007-08-08 14:54:48

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