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包裝膠packaging热熔胶
熱熔膠是以熱塑性樹脂或熱塑性彈性體為主成分，以增粘劑、增塑劑、抗氧化劑、阻燃劑及填料為添加成分經熔融混合而制成的不含溶劑的固體狀粘合劑。使用時只要加熱便熔融，待冷卻後即形成固化，成品形狀有粒狀、棒狀、塊狀、薄膜狀等形式在市場上銷售。它能對各種材料進行接著，如木材、紙張、纖維、金屬、塑料等，使用範圍很廣。但大量使用的行業主要是纖維業、包裝業及裝訂(印刷)行業。它的優點是不含溶劑、對環境不會造成污染、接...
http://www.polymer.cn/PY11555/index |
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涂料原材料 Coatings Raw Materials
涂料原材料 Coatings Raw Materials
树脂及基料 Resins & Binders
http://www.polymer.cn/PY13586/index |
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Preparation and Properties of Poly(vinyl alcohol)-organ nanoclay dispersion for Water Vapour Barrier Coatings of Paperboard Packaging
关键字：Preparation,Properties,Poly,vinyl,alcohol,organ,nanoclay,dispersion,Water,Vapour,Barrier,Coatings,Paperboard,Packaging,
Polymer dispersions can be used for coating paper products in order to e.g. enhance their barrier properties.
http://www.polymer.cn/research/dis_info5876 |
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Preparation and Properties of Poly(vinyl alcohol)-organ nanoclay dispersion for Water Vapour Barrier Coatings of Paperboard Packaging
关键字：Preparation,Properties,Poly,vinyl,alcohol,organ,nanoclay,dispersion,Water,Vapour,Barrier,Coatings,Paperboard,Packaging,
Polymer dispersions can be used for coating paper products in order to e.g. enhance their barrier properties.
http://www.polymer.cn/research/dis_info5876 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
| |
Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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