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Preparation and Properties of Poly(vinyl alcohol)-organ nanoclay dispersion for Water Vapour Barrier Coatings of Paperboard Packaging
关键字：Preparation,Properties,Poly,vinyl,alcohol,organ,nanoclay,dispersion,Water,Vapour,Barrier,Coatings,Paperboard,Packaging,
Polymer dispersions can be used for coating paper products in order to e.g. enhance their barrier properties.
http://www.polymer.cn/research/dis_info5876 |
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Preparation and Properties of Poly(vinyl alcohol)-organ nanoclay dispersion for Water Vapour Barrier Coatings of Paperboard Packaging
关键字：Preparation,Properties,Poly,vinyl,alcohol,organ,nanoclay,dispersion,Water,Vapour,Barrier,Coatings,Paperboard,Packaging,
Polymer dispersions can be used for coating paper products in order to e.g. enhance their barrier properties.
http://www.polymer.cn/research/dis_info5876 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15115 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：Polymer nanocomposites, Electronic packaging, Review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/sy_info15114 |
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Advances in Polymer Nanocomposites for Electronic Packaging
关键字：polymer nanocomposites, electronic packaging, review
Chips based on integrated circuits (ICs) have been widely used in the electronic information industry, and the flip-chip technology based on underfill process is becoming a most promising packaging method due to the&...
http://www.polymer.cn/research/dis_info17187 |
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Electrospun Antimicrobial Polylactic Acid/Tea Polyphenol Nanofibers for Food-Packaging Applications.
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http://www.polymer.cnt//ss/liuyaowen/publicationsshow_13335.html |
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BIODEGRADABLE LOW DENSITY POLYETHYLENE (LDPE)/TAPIOCA STARCH PACKAGING FILMS
关键字：BIODEGRADABLE,LOW,DENSITY,POLYETHYLENE,LDPE,TAPIOCA,STARCH,PACKAGING,FILMS,
Worldwide production of plastics is more than 78 million tons per year and almost half of that discarded within short time, remaining in garbage deposits and landfills for decades (more than 30 years) [1].
http://www.polymer.cn/research/dis_info5850 |
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