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Fabrication and properties of paper coatings with the incorporation of nanoparticle pigments: rheological behavior
In the present work, TiO2 nanoparticles and CaCO3 nanoparticles were employed as additive pigments to modify theproperties of conventional paper coatings.A series of paper coating formulations were designed and fabricated, with a focus on the effect of nanoparticle pigments on the rheological behavior of paper coatings.Furthermore, the role of corr...
http://www.polymer.cn//ss/tangyanjun/publicationsshow_7771.html |
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Effect of various cellulose derivatives on the properties of pigment coatings: a comparative study
Due to the low-cost, earth-abundant
availability and eco-friendly characteristics, cellulose derivatives (CDs)
are being increasingly used as co-binders in the production of pigment coatings. In the present work, a comparative study on the effect of nanocrystalline cellulose (NCC) and sodium carboxymethyl cellulose (CMC) on the colloidal stability and rheological pro...
http://www.polymer.cn//ss/tangyanjun/publicationsshow_7768.html |
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Preparation and properties of potassium hexatitanate whisker based thermal insulation coil coatings
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http://www.polymer.cn//ss/caizhiqi/publicationsshow_5447.html |
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Polypeptide Nanotechnology Coatings for Preventing Dental and Orthopaedic Device-Associated Infection
Implant-associated infection is one of the most common and problematic complications for dental and orthopaedic patients. Modification of currently used implant surfaces aimed at bestowing them with antibacterial properties is a promising approach in the development of new biomaterials. In this study, a novel nanotechnology, that is, electrostatic self-assembly, was developed to construct biomi...
http://www.polymer.cn//ss/bingbingjiang/publicationsshow_4608.html |
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Multilayer polypeptide nanoscale coatings for the prevention of biomedical device associated infections
Biomedical device-associated infection is one of the most common and problematic complications faced by millions of patients worldwide. The current antibiotic therapy strategies face challenges, the most serious of which is antibiotic resistance. Studies have shown that the systemic level of interleukin 12 (IL-12) decreases following major injuries resulting in decreased cell-mediated immune ...
http://www.polymer.cn//ss/bingbingjiang/publicationsshow_4607.html |
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Preparation of composited Nano-TiO2 and its application on antimicrobial and self-cleaning coatings
Composite nano-TiO2with doping Fe3+Rand Agwas prepared, and furthermodified by 3-methacryloxypropyltrimethoxysilane.They were characterized by Zetasizer Nano ZS Particle and Zeta Potential Analyzer, X-ray diffraction, UV–Vis spectrophotometer, FT–IR spectra, and transmission electron microscopy. The modified composite nano-TiO2 was applied to prepare multifunctional fluorocarbon coatin...
http://www.polymer.cn//ss/wangrongmin/publicationsshow_2892.html |
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Use of Biodegradable Polymers to improve new Antifouling coatings :Erosion of marine paints
关键字：Use,Biodegradable,Polymers,improve,new,Antifouling,coatings,Erosion,marine,paints,
It is generally agreed that the prevention of marine fouling can be achieved by coatings from which a controlled release of toxic molecules prevents the growth of adhered organisms (bacteria, algae, molluscs)by killing them.
http://www.polymer.cn/research/dis_info5856 |
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Use of Biodegradable Polymers to improve new Antifouling coatings :Erosion of marine paints
关键字：Use,Biodegradable,Polymers,improve,new,Antifouling,coatings,Erosion,marine,paints,
It is generally agreed that the prevention of marine fouling can be achieved by coatings from which a controlled release of toxic molecules prevents the growth of adhered organisms (bacteria, algae, molluscs)by killing them.
http://www.polymer.cn/research/dis_info5856 |
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Reduced Graphene Oxide with Stable Dispersibility Used as Thermal Conductive Filler of Polymeric Electronic Packaging Material
关键字： Reduced graphene oxide, Thermal conductivity, Epoxy, Composites
Polymeric electronic packaging materials, especially epoxy resins, are generally used in micro-electronic packaging industry. However, the low thermal conductivity(0. 2-0. 4 W/mK) of epoxy resin[l] is its major drawbac...
http://www.polymer.cn/research/dis_info17354 |
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Reduced Graphene Oxide with Stable Dispersibility Used as Thermal Conductive Filler of Polymeric Electronic Packaging Material
关键字： Reduced graphene oxide, Thermal conductivity, Epoxy, Composites
Polymeric electronic packaging materials, especially epoxy resins, are generally used in micro-electronic packaging industry. However, the low thermal conductivity(0. 2-0. 4 W/mK) of epoxy resin[l] is its major drawbac...
http://www.polymer.cn/research/dis_info17354 |
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