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Reduced Graphene Oxide with Stable Dispersibility Used as Thermal Conductive Filler of Polymeric Electronic Packaging Material  
Reduced Graphene Oxide with Stable Dispersibility Used as Thermal Conductive Filler of Polymeric Electronic Packaging Material
资料类型: PDF文件
关键词: Reduced  graphene  oxide  Thermal  conductivity  Epoxy  Composites  
资料大小: 109K
所属学科: 分子表征
来源: 第六届亚欧研讨会上处理和性能增强聚合物会议文集(2013.6.2-6 武汉)
简介:
Polymericelectronicpackagingmaterials,especiallyepoxyresins,aregenerallyusedinmicro-electronicpackagingindustry.However,thelowthermalconductivity(0.2-0.4W/mK)ofepoxyresin[l]isitsmajordrawback.Thus,highthermalconductivefillers,suchasmetalpowders,semicondutivesolidnanoparticles,carbonnanomaterials,havebeenincorporatedintopolymermatrixtoimprovethethermalconductivityofcomposites.Graphenec2],anatom-thickgraphiteplatelet,hasattractedintensiveinterestduetoitssuperiorthermalconductivityc3].However,itspoordispersibilityinlowboilingpointsolvents,suchasethanol,affectsitsexfoliationanddispersionincompositesbysolvent-mixingpreparationprocess,therebyaffectstheperformanceofcomposites.Inourstudy,weusedmodifiedHummers,methodc4]topreparegraphiteoxideastheprecursorofgraphene;then,accordingtotherouteinMinandcolleagues‘studyc5],hydrazinewasusedasthereductionagenttopreparereducedgrapheneoxidetoobtainstabledispersibilityinethanolbycontrollingtheamountofhydrazine;finally,themixtureofreducedgrapheneoxideandE-51epoxypreparedbysolvent-mixingwascuredtoformcompositetemplate.Thiskindofreducedgrapheneoxideisexpectedtoimprovethethermalconductivityofcomposites.
作者: Y. Xue, C. Chen , Y. G. Liao, Z. G. Xue , H. M. Zhou, X. L. Xie
上传时间: 2013-07-04 14:56:49
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