简介: |
Epoxyresinswithvaryingcontentsofsiliconintermediatewerecuredusingisophoronediamine(IPDA)asacuringagent.Mechanicaltesting,thermogravimetricanalysis(TGA)andscanningelectronmicroscope(SEM)werecarriedouttoanalysisthemechanicalproperties,heatresistancebehaviorsandmorphologiesofcuredpureepoxyaswellasmodifiednetworks. |
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